Forte 51mm Wet Cut Diamond Hole Saw - ½" BSP Unit of Measure:EACH Ultra-fast hardening self-levelling compound used

Ultra-fast hardening self-levelling compound used for interior levelling and removing differences in thickness of new or existing substrates

ideal for the intensive cutting of ceramic and porcelain tiles

For dry cutting

Can be used with directly with a grinder with a M14 thread

Replacement Wheel Stock No: 0294/0296

Forte 51mm Wet Cut Diamond Hole Saw - ½" BSP Unit of Measure:EACH Ultra-fast hardening self-levelling compound usedProven range of high quality laser welded diamond hole cutters for use on very hard ceramics, natural stones and porcelain. 1 2 inch BSP Thread For wet cutting Connected to drill via water fed swivel connector (Stock No: 0915)